The etching plate heat exchanger sheet is specifically used in the plate heat exchanger to isolate the media and heat exchange plate, is an important part of the plate heat exchanger. The quality of the plate heat exchanger plate affects the overall performance and working condition of the plate heat exchanger. The main materials we use in plate heat exchanger sheet are stainless steel, titanium and titanium-palladium.
Half Etching Metal plates thin metal plates with corrugations, sealing grooves and angular holes, which are important heat transfer elements. Corrugation can not only strengthen the heat transfer and can increase the rigidity of the thin plate and thus improve the pressure-bearing capacity of the plate heat exchanger, and as a result of the liquid is turbulent, it can reduce the formation of sediment or dirt, play a certain "self-cleaning" role.
We custom plate heat exchanger sheet with drawings provided by customers. We are equipped with professional metal etching equipment and exposure development equipment. We can guarantee that our half etching plate heat exchanger sheet have straight surface line, and have no burr, high product accuracy.
Etching Plate Heat Exchanger Sheet,Custom Plate Heat Exchanger Sheet,Half Etching Metal Plates,Half Etching Plate Heat Exchanger Sheet SHAOXING HUALI ELECTRONICS CO., LTD. , https://www.cnsxhuali.com
Sina Technology News, February 17 – In a recent announcement, Coolpad has revealed plans to issue 653,189,580 rights shares. The offering will be priced at HK$1.10 per share, based on a ratio of 3 rights shares for every 20 existing shares. This represents approximately 15% of the company's current outstanding shares, and after the issuance, it will account for 13.04% of the total issued shares.
The fundraising from this rights issue is expected to reach around HK$696 million, or approximately RMB 584 million after deducting related expenses. UOB has been appointed as the underwriter for the offering. This move is seen as an important step for Coolpad to strengthen its financial position and support future growth initiatives.
Following the completion of the rights issue, the company’s shareholding structure is expected to undergo a significant change. A detailed breakdown of the new ownership distribution can be found in the image below:
This development comes at a crucial time for Coolpad as it continues to navigate the competitive smartphone market and explore new opportunities for expansion. Investors are closely watching how this capital raise will impact the company's long-term strategy and performance.