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In the wake of a powerful earthquake that struck South Taiwan on the 206th, semiconductor giants TSMC and UMC were forced to halt operations at their Nanke facilities. The incident has raised global concerns over supply chain disruptions, as both companies play crucial roles in the global chip manufacturing industry.
The earthquake, which hit the region with significant intensity, led to immediate shutdowns at the two major wafer fabrication plants. TSMC’s Nanke plant, home to both 8-inch and 12-inch wafer production lines, including advanced 16nm and 20nm processes for Apple A9 chips, was among the hardest hit. Similarly, UMC's facility, a key player in the Internet of Things (IoT) sector, also experienced a temporary stoppage.
Both companies swiftly initiated emergency protocols. TSMC deployed over 300 employees from its Hsinchu and Taichung sites to assist in the recovery efforts, while UMC urged its affected staff to return to work immediately. Despite the disruption, both firms have expressed confidence in resuming operations within three days, a response that industry experts describe as "beyond international standards."
According to reports, the process of restarting production involves thorough inspections of machinery, gas pipelines, and other critical infrastructure. Safety checks are essential before any employees can return to the factory floor, as even minor leaks or structural issues could lead to prolonged downtime.
Industry insiders note that while Taiwan is no stranger to seismic activity, the epicenter of this quake was located near the heart of the country’s advanced chip manufacturing base. This proximity made it impossible for either company to ignore the potential risks. As a result, both TSMC and UMC took extra precautions to ensure the safety of their workers and facilities.
TSMC’s spokesperson, Sun Youwen, confirmed that all employees had been evacuated after the quake and would only return once the site was deemed safe. He added that the company aimed to restore more than 95% of its production capacity within three days. UMC, on the other hand, emphasized that its internal procedures and rapid response team helped minimize the impact of the disaster.
Meanwhile, local authorities and park administrators also played a vital role in the recovery. Emergency teams were set up early in the morning to monitor the situation and coordinate support for affected manufacturers. The LINE group, formed by the response team, continuously tracked the status of key equipment and buildings to ensure a swift and safe return to normal operations.
As the semiconductor industry continues to monitor the situation, the resilience of TSMC and UMC has been widely praised. Their ability to quickly mobilize resources and resume operations reflects the high level of preparedness and coordination within the sector. However, the incident serves as a reminder of the vulnerabilities inherent in global supply chains and the importance of robust disaster response strategies.