Directly bypassed the 830? Qualcomm confirmed Xiaolong 835 is MSM8998

Tencent Digital (Compiled: Remarks) Rumors about Qualcomm's model MSM8998 processor have appeared many times in 2016, and many people regard this processor as the next-generation Xiaolong 830, but Last week, Qualcomm has officially released a new generation of flagship Xiaolong 835, which seems to have crossed Xiaolong 830's fictitious "star product".

Recently, Qualcomm has confirmed that its next-generation flagship is indeed MSM8998, but it is not what everyone calls the Xiaolong 830, but the details of Qualcomm's responsible person did not give exact answers.

In April of this year, MSM8998 appeared in the support list of Windows 10 Mobile system. After a few months, this processor was removed from the list. With the appearance of Xiaolong 625, Xiaolong 830 gradually faded out. People's vision. Now that Qualcomm has officially announced the Snapdragon 835, it has still not announced the minimum configuration requirements for the system.

Not too long ago, there was news that Microsoft is developing an x86 architecture based on ARM64, which will be one of the important new features of Windows 10 Redstone 3 update. According to Mary Jo Foley's report, Qualcomm's next processor will meet Windows 10's requirements for analog capabilities, and this is the so-called Opteron 835.

The MSM8998 will be manufactured using a 10nm FinFET process and will work with Samsung. So we can expect that this processor will officially meet with us in the first half of 2017, and Windows 10 Redstone 3 update will also come in the second half of 2017.

Source: neowin

Peelable Solder Mask

Peel Mask PCB

Peel able masks are used in order to protect selected solder holes against plugging during mass soldering or to protect carbon elements and gold plated contacts during mass soldering. Peel able masks are screen printed.


Requirements

• The peelable mask must adhere sufficiently well to the PCB so that it does not peel off when handled correctly.
• It must be able to endure a two to three time soldering process without peeling off, but must remain detachable.
•After soldering of the PCB, the peelable mask must be able to be detached – preferably in one piece. In case of metallized holes, no mask
residue must be left in the drill holes or on the surface of the PCB. In the case of non-metallized drill holes, however a certain amount of residue
can remain.
• The peelable mask must be able to resist conventional solvents such as chlorinated and fluorinated hydrocarbons, isopropanol, conventional
fluxes and similar.
• Particular requirements: The roughness U of the edge of the mask can be 0,5 mm from the tip to the base (left figure
below).

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