MOSO UFO High Bay LED Driver have the character of high power factor, high efficiency, high reliability and high-precision constant current. The UFO led driver owns a complete of function, various specifications can meet more different parameter of customers` requirement.
MOSO Intelligent innovator UFO shape led power has the led driver industry '
s unique derating over temperature protection circuit , which can make the light power supply not easy suddenly
happen the phenomenon of over - temperature and shutdown even under the harsh
working environment , so as to ensure continuous illumination.
The efficiency of the led driver supply is high and the power consumption is small.
Accordingly, the heat in the lamp is small, then it reduce the temperature rise
of the lamp. It is more advantage to delay the light decay of LED.
This Circular high-bay lighting drivers creatively integrated limited power,
0~10V/PWM dimming, dali control is optional.
Dali
Industrial Light LED Driver complied with
CCC/CE/ENEC/UL/SAA/CB safety regulations. Surge immunity is DM-4KV,CM-6KV.
High Bay LED Driver,Waterproof High Bay LED Driver,Modern High Bay LED Driver,UFO High Bay LED Driver Moso Electronics , https://www.mosoleddriver.com
According to reports, although some companies have achieved this efficiency at the research level, as a product that can be mass-produced, the luminous efficiency of 170lm/W is the highest in the industry. The new product is currently sampling, and volume production is scheduled for April 2012. It will mainly be equipped with fluorescent LED lighting and basic lighting. 
Toyota Synthesis of Japan has disclosed new white LED products with higher efficiency and greater luminous flux. By achieving a highly efficient 3528 package (package size 3.5mm × 2.8mm), the luminous efficiency is increased from the original 150lm / W (input current 20mA) to 170lm / W (input current 20mA).
Toyota Synthetic also showed a 2000lm class of high luminous flux. This is a multi-chip COB product with a FU package (with a luminous flux of 2000 lm at 470 mA) and an FC package (with a luminous flux of 2000 lm at 1500 mA). In terms of power consumption, the FU package is 20W and the FC package is 25W. Both products are currently available for sample delivery. The production time is scheduled for April 2012.
The package substrate and LED chip package of the FU package and the FC package are made of an inorganic material, thereby improving heat resistance. In addition, the FC package is packaged in a flip-chip package, and the LED chip is directly packaged on the package substrate, thereby achieving high reliability and high heat dissipation. Moreover, miniaturization has been successfully achieved by reducing the package interval of the LED chips. Since large luminous flux can be obtained in a small package, the FC package is best suited for small spotlight illumination sources that require brightness. Thanks to a single package, multiple shadows can be prevented.