LED packaging: COB has become mainstream

The scale of China's LED packaging industry increased from 25 billion yuan in 2010 to 28.5 billion yuan in 2011, and output increased from 133.5 billion in 2010 to 182 billion in 2011. Among them, the output value of high-bright LED reached 26.5 billion yuan, accounting for more than 90% of total LED sales.

In 2011, China's semiconductor lighting energy-saving industry's core technology, personnel training, standard system and lack of funds still exist. Coupled with the disorderly competition and blind investment between enterprises, some companies have closed down one after another, making the LED industry unable to continue in 2010. The good momentum of development in 2013 has entered a new stage of transformation of the competition model and restructuring of the industry. But even so, China's LED lighting industry is still one of the fastest growing regions in the world, and has initially formed a competitive situation with Europe, America, Japan and South Korea.

Significantly improved technical level

After the introduction, absorption, digestion and improvement, the packaging technology of some enterprises has reached the international advanced level.

Although China lacks original packaging technology, after the introduction, absorption, digestion and improvement, some companies' LED packaging technology has already been comparable to international advanced LED packaging companies in certain fields. Using domestic chips and low-power chips to package into white LEDs, the light efficiency can reach 30lm / W ～ 150lm / W; using power chips to package into white LEDs, the light efficiency can reach 100lm / W ～ 110lm / W, while using imported chip packaging LED light efficiency can reach more than 135lm / W.

With the continuous improvement of domestic LED chip levels and multiple innovations in packaging technology, domestic LED companies have achieved better product performance through joint innovation. At the end of 2011, Sanan Optoelectronics, Fujian Wanbang Optoelectronics Technology Co., Ltd., Hercynian Research Institute of Chinese Academy of Sciences, and Sichuan Xinli Light Source Co., Ltd. jointly released ultra-high-efficiency LED fluorescent tubes that were jointly innovatively developed. The overall lighting effect reached 150lm / W, the color rendering index was 70.5, and the power factor was 0.8, setting a world record for LED fluorescent tube 140.1lm / W overall lighting effect, which was also released by them in September 2011. And this product uses the packaging patent technology with independent intellectual property rights of Haixi Research Institute and Wanbang Optoelectronics, as well as high-efficiency chips made by Sanan Optoelectronics and high-efficiency phosphors made by Xinli Light Source.

COB packaging into a development trend

At present, COB-encapsulated bulbs have occupied about 40% of the LED bulb market.

With the gradual maturity of the LED application market, users are increasingly demanding product stability and reliability, especially under the same conditions, requiring products to achieve better energy efficiency indicators, lower power consumption, and more competition Product price. Based on this, compared with the traditional LED SMD chip package and high-power package, chip-on-board (COB) integrated packaging technology encapsulates multiple LED chips directly on a metal-based printed circuit board as a lighting module through the substrate Direct heat dissipation not only reduces the manufacturing process and cost of the bracket, but also has the advantage of reducing the heat resistance of the heat dissipation, so it has become a LED lighting module packaging technology mainly promoted by many large manufacturers.

COB packaging matches LED chip particles with the same electrical parameters, designs a matrix arrangement of combined light sources according to power, and binds N particle LEDs to an aluminum substrate or a ceramic substrate through the COB packaging process to become a new LED light source module group.

At present, COB-encapsulated bulbs have occupied about 40% of the LED bulb market, and many domestic companies have begun to adopt the COB packaging model. Industry insiders predict that COB packaging will become an inevitable trend for future development.

In addition to good heat dissipation performance and low cost, COB light source can also be personalized. However, in terms of technology, COB packaging still has shortcomings such as light attenuation, short life, and poor reliability. If it can be solved, it will be one of the leading directions of packaging development in the future.